In a recent teardown, the repair site iFixit conducted an in-depth analysis of the iPhone Air, which is recognized as Apple's thinnest iPhone to date. This model marks the first significant redesign in the iPhone lineup in several years, showcasing innovative engineering and design choices.
To accommodate all necessary components within its sleek 5.6mm frame, Apple implemented a unique camera plateau design. The logic board of the iPhone Air is strategically located partially within the camera bump, allowing for the inclusion of a large, metal-encased battery. This arrangement not only maximizes space but also protects the logic board from bending stress, ensuring durability even when the device flexes. Notably, earlier tests have demonstrated that the titanium frame of the iPhone Air is nearly bend-proof, although iFixit noted that when the frame was tested without components, it exhibited more vulnerability to bending.
iFixit pointed out that the iPhone Air frame contains some weak points due to the addition of plastic gaps meant to prevent cellular interference. Whether these weak points will pose a significant concern for users remains to be seen, as iFixit commented, "time will tell." This observation raises questions about the long-term reliability of the device under everyday use conditions.
Earlier this week, iFixit also disassembled the MagSafe Battery designed for the iPhone Air and discovered that it utilizes the same battery as the iPhone itself. With a capacity of 12.26 watt-hours, this battery can be easily removed from the MagSafe Battery pack and transferred to the iPhone Air. This compatibility reflects Apple's focus on user convenience and device versatility.
Despite its thinner design, the iPhone Air is easier to repair than many might expect. iFixit highlighted that the compact chassis prevents components from being layered, which simplifies access. The device features a clipped-in display and back glass that are easier to remove. Additionally, Apple has implemented adhesive that can be loosened using a low-voltage electrical current, a design choice first introduced with the iPhone 16 and now extended to newer models.
In a notable engineering feat, Apple has 3D printed the USB-C port for the iPhone Air, utilizing a titanium alloy that is structurally robust but not as scratch-resistant as the frame. Although glued in place, the USB-C port is modular, allowing for easier removal if necessary. Inside the iPhone Air, the logic board houses several custom-designed Apple chips, including the C1X 5G modem, the N1 networking chip, and the A19 Pro processor. This model is the first iPhone to integrate such a high number of custom chips, enhancing performance and efficiency.
Overall, iFixit awarded the iPhone Air a provisional repairability score of 7 out of 10, citing the ease of accessing the battery and the relatively straightforward process of screen replacement. Apple has made strides in improving the repairability of its devices by offering spare parts and manuals, while also reducing software locks and restrictions on parts pairing. These efforts contribute positively to the iPhone repairability landscape.
For a comprehensive look at the teardown process, be sure to check out iFixit's full video, where the iPhone Air is disassembled piece by piece.
