TSMC has reportedly started accepting orders for its groundbreaking 2nm wafers, but the highly anticipated first chipsets utilizing this advanced lithography technology are not expected to be available until late next year. As many tech enthusiasts already know, Apple is poised to be the first company to take advantage of this cutting-edge technology, with the highly rumored A20 chipset set to be mass-produced using the 2nm process.
According to rumors, Apple will incorporate TSMC's innovative Wafer-Level Multi-Chip Module (WMCM) packaging for the A20 chipset. This strategic move is designed to provide significant advantages, but users will only experience these benefits if they choose to make the upcoming iPhone 18 Pro, iPhone 18 Pro Max, or the anticipated iPhone 18 Fold their primary devices. Interestingly, sources indicate that Apple will maintain the current RAM configuration, keeping it at 12GB across all iPhone models featuring the A20.
The integration of WMCM packaging in the A20 chipset is expected to be a game-changer for Apple. This advanced technique allows Apple to maintain the chipset's physical footprint while simultaneously offering immense flexibility in combining various components. Essentially, multiple dies—including the CPU, GPU, memory, and other essential parts—can be integrated at a wafer level before being sliced into individual chips. This innovative approach will enable Apple to mass-produce smaller chipsets that are not only power-efficient but also deliver exceptional performance, leading to an impressive performance per watt metric.
According to a report from China Times, the A20 upgrade will debut with the iPhone 18 Pro, iPhone 18 Pro Max, and the forthcoming iPhone 18 Fold. TSMC's specialized production line for WMCM chipsets will be established in Chiayi AP7, boasting an estimated monthly production capacity of 50,000 units by the end of 2026. However, despite the advancements in chipset technology, Apple is expected to retain the 12GB RAM limit that has been standard this year.
We have previously reported on the transition of the iPhone 18 series to TSMC’s WMCM packaging. Additionally, there are rumors suggesting that the A20 will be approximately 15% faster than its predecessor, the A19, while maintaining the same power consumption levels. However, it remains unclear whether the more affordable models of the iPhone 18 will feature chipsets with WMCM packaging or if Apple plans to cut costs by using the older Integrated Fan-Out (InFo) packaging method.
All these questions will likely be addressed in the fourth quarter of 2026 when the iPhone 18 family is officially unveiled. Stay tuned for more updates as we approach this exciting launch!
